DocumentCode

2598282

Title

Identification and Elimination of a Failure Mechanism in Semiconductor Devices

Author

Longo, T.A. ; Selikson, B.

Author_Institution

Sylvania Semiconductor Division, Woburn, Massachusetts

fYear

1963

fDate

Sept. 1963

Firstpage

424

Lastpage

435

Keywords

Aluminum; Bonding; Failure analysis; Gold; Lead compounds; Metallization; Semiconductor devices; Silicon; Temperature; Wire;

fLanguage

English

Publisher

ieee

Conference_Titel

Physics of Failure in Electronics, 1963. Second Annual Symposium on the

Conference_Location

Chicago, IL, USA

ISSN

0097-2088

Type

conf

DOI

10.1109/IRPS.1963.362258

Filename

4207609