Title :
Missile Failure Due to Impurities in Electroplates
Author_Institution :
Consultant, Picatinny Arsenal, Dover, N.J.
Keywords :
Bonding; Circuits; Coatings; Copper; Gold; Impurities; Missiles; Surface contamination; Surface treatment; Welding;
Conference_Titel :
Physics of Failure in Electronics, 1963. Second Annual Symposium on the
Conference_Location :
Chicago, IL, USA
DOI :
10.1109/IRPS.1963.362261
