• DocumentCode
    2599005
  • Title

    Averaging approach for microchannel heat sinks subjected to the uniform wall temperature condition

  • Author

    Kim, Dong-Kwon ; Kim, Sung Jin

  • Author_Institution
    Korea Adv. Inst. of Sci. & Technol., Daejon, South Korea
  • fYear
    2004
  • fDate
    8-10 Dec. 2004
  • Firstpage
    569
  • Lastpage
    574
  • Abstract
    The present paper is devoted to the modeling method based on an averaging approach for thermal analysis of microchannel heat sinks subjected to the uniform wall temperature condition. Solutions for velocity and temperature distributions are presented using the averaging approach. When the aspect ratio of the microchannel is higher than 1, these solutions accurately evaluate thermal resistances of heat sinks. Asymptotic solutions for velocity and temperature distributions at the high-aspect-ratio limit are also presented by using the scale analysis. Asymptotic solutions are simple, but shown to predict thermal resistances accurately when the aspect ratio is higher than 10. The effects of the aspect ratio and the porosity on the friction factor and the Nusselt number are presented. Characteristics of the thermal resistance of microchannel heat sinks are also discussed.
  • Keywords
    friction; heat sinks; modelling; numerical analysis; porosity; temperature distribution; thermal analysis; thermal resistance; Nusselt number; aspect ratio; asymptotic solutions; averaging approach; friction factor; microchannel heat sinks; porosity; temperature distribution; thermal analysis; thermal resistance; uniform wall temperature condition; velocity distribution; Electronic components; Electronics cooling; Heat sinks; Heat transfer; Immune system; Microchannel; Predictive models; Resistance heating; Temperature distribution; Thermal resistance;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronics Packaging Technology Conference, 2004. EPTC 2004. Proceedings of 6th
  • Print_ISBN
    0-7803-8821-6
  • Type

    conf

  • DOI
    10.1109/EPTC.2004.1396672
  • Filename
    1396672