Title :
The Role of Compound Formation on Semiconductor Device Reliability
Author_Institution :
Sylvania Electric Products, Inc., Woburn, Massachusetts
Keywords :
Aluminum; Bonding; Degradation; Gold; Intermetallic; Semiconductor device reliability; Semiconductor diodes; Silicon; Temperature; Wire;
Conference_Titel :
Physics of Failure in Electronics, 1964. Third Annual Symposium on the
Conference_Location :
Chicago, IL, USA
DOI :
10.1109/IRPS.1964.362298
