Antenna-in-package solution for 3D integration of millimeter-wave systems using a thin-film mcm technology

Summary form only given, as follows. A cavity-backed antenna element is introduced and investigated for the antenna-in-package applications at 60 GHz frequency band. A thin-film silicon-based technology is used to implement the antenna element and two different configurations for 1×4 arrays of the same element. The feeding networks of the arrays are designed in such a manner that one of them has its main beam in the broad-side direction while the main beam of the second one is rotated to 45 degrees. Simulation and measurement results of return loss, radiation patterns and realized peak gains are compared.