Title :
Emerging technologies: 3D ICs & clock distribution (T-V)
Author :
Gu, Xiaoxiong ; Rosenbaum, Elyse
Author_Institution :
IBM, NY, USA
Abstract :
Start of the above-titled section of the conference proceedings record.
Conference_Titel :
Electrical Performance of Electronic Packaging and Systems (EPEPS), 2011 IEEE 20th Conference on
Conference_Location :
San Jose, CA
Print_ISBN :
978-1-4244-9398-2
Electronic_ISBN :
pending
DOI :
10.1109/EPEPS.2011.6100193
