Title :
Fast full-wave modeling of passive structures with graphic processors
Author :
Chiariello, Andrea G. ; Maffucci, A. ; Villone, F. ; Nicolazzo, Massimo
Author_Institution :
Dept. D.A.E.I.M.I., Univ. of Cassino, Cassino, Italy
Abstract :
A parallel computation approach based on the properties of the Graphics Processor Units (GPU) is here presented to speed-up the broadband modeling of passive 3D structures. The full-wave electromagnetic model is based on a surface integral formulation, numerically implemented by using a null-pinv decomposition of the unknowns. The numerical model has been proven to be accurate and well-posed for a frequency range from DC to hundreds of GHz. A bottleneck of the model is the assembly of fully populated matrices and the final matrix inversion. This paper presents A GPU parallelization of the matrix assembly phase, and analyzes two case-studies which refer to full-wave analysis of interconnects. The achieved speedup with respect to a conventional serial approach is around 50x.
Keywords :
graphics processing units; integrated circuit interconnections; integrated circuit modelling; GPU parallelization; broadband modeling; fast full-wave modeling; full-wave analysis; full-wave electromagnetic model; graphics processor unit; interconnects; matrix assembly; matrix inversion; null-pinv decomposition; parallel computation; passive 3D structure; surface integral formulation; Assembly; Computational modeling; Graphics processing unit; Integral equations; Numerical models; Surface impedance; Three dimensional displays; CUDA; EFIE; GPU; full-wave modeling; interconnects;
Conference_Titel :
Electrical Performance of Electronic Packaging and Systems (EPEPS), 2011 IEEE 20th Conference on
Conference_Location :
San Jose, CA
Print_ISBN :
978-1-4244-9398-2
Electronic_ISBN :
pending
DOI :
10.1109/EPEPS.2011.6100218