Title :
Purple Plague and Gold Purity
Author_Institution :
RCA Corporation, Somerville, New Jersey
Abstract :
The failure of aluminum-to-gold ultrasonic bonds, after storage at elevated temperature, is often accompanied by the presence of "purple plague". However, this purple intermetallic phase can also be present in bonds that remain strong after the same treatment. Bond failure has been connected with the presence of impurities in the gold and a failure mechanism is proposed.
Keywords :
Aluminum; Bonding forces; Circuit testing; Gold; Integrated circuit packaging; Intermetallic; Life testing; Nitrogen; Temperature; Wire;
Conference_Titel :
Reliability Physics Symposium, 1972. 10th Annual
Conference_Location :
Las Vegas, NV, USA
DOI :
10.1109/IRPS.1972.362544
