DocumentCode :
2603381
Title :
Edge-Connector Failure Mechanisms
Author :
Byrne, W.J.
Author_Institution :
Reliability Engineer, Memorex Corporation, San Tomas, Central Expressway, Santa Clara, California 95052
fYear :
1972
fDate :
26390
Firstpage :
193
Lastpage :
200
Abstract :
This paper presents the results of an environmental and contact physics study evaluating edgecard connectors from nine manufacturers. Interfacial contact resistance (constriction resistance) was used to monitor contact degradation and can reproducibly provide distributions in resistance characteristic of manufacturer. These techniques have shown that for connectors used in commercial applications, ingress of corrosive reactants through porous gold plate dominates normal force fluctuations in causing contact failure. This is due principally to variations in plating thickness and is a result of poor quality control.
Keywords :
Condition monitoring; Connectors; Contact resistance; Degradation; Failure analysis; Fluctuations; Gold; Physics; Pulp manufacturing; Quality control;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Reliability Physics Symposium, 1972. 10th Annual
Conference_Location :
Las Vegas, NV, USA
ISSN :
0735-0791
Type :
conf
DOI :
10.1109/IRPS.1972.362551
Filename :
4207923
Link To Document :
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