Title :
Edge-Connector Failure Mechanisms
Author_Institution :
Reliability Engineer, Memorex Corporation, San Tomas, Central Expressway, Santa Clara, California 95052
Abstract :
This paper presents the results of an environmental and contact physics study evaluating edgecard connectors from nine manufacturers. Interfacial contact resistance (constriction resistance) was used to monitor contact degradation and can reproducibly provide distributions in resistance characteristic of manufacturer. These techniques have shown that for connectors used in commercial applications, ingress of corrosive reactants through porous gold plate dominates normal force fluctuations in causing contact failure. This is due principally to variations in plating thickness and is a result of poor quality control.
Keywords :
Condition monitoring; Connectors; Contact resistance; Degradation; Failure analysis; Fluctuations; Gold; Physics; Pulp manufacturing; Quality control;
Conference_Titel :
Reliability Physics Symposium, 1972. 10th Annual
Conference_Location :
Las Vegas, NV, USA
DOI :
10.1109/IRPS.1972.362551