Title :
Further Studies on the Reliability of Thin-Film Nickel-Chromium Resistors
Author :
Paulson, Wayne M.
Author_Institution :
Senior Metallurgist, Materials Research Laboratory, Motorola, Inc., 5005 E. McDowell Road, Phoeniz, Arizona 85008
Abstract :
The reliability of thin-film Ni-Cr resistors was studied with respect to the effects of corrosion, oxidation and interdiffusion. Water on unpassivated films resulted in anodic dissolution at potentials above 2.5 volts. Oxidation increased the resistivity and lowered the T.C.R. to 20 ppm/°C. Aluminum diffused into the NiCr with an activation energy of 96 kcal/mole.
Keywords :
Anodes; Chromium; Circuit testing; Conductivity; Corrosion; Heat treatment; Materials reliability; Oxidation; Resistors; Transistors;
Conference_Titel :
Reliability Physics Symposium, 1973. 11th Annual
Conference_Location :
Las Vegas, NV, USA
DOI :
10.1109/IRPS.1973.362568
