Title :
Dynamic Thermal Properties of IMPATT Diodes
Author :
Rossiter, Thomas J.
Author_Institution :
Reliability Branch, Rome Air Development Center, Griffiss AFB NY 13441
Abstract :
Dynamic heating effects in IMPATT diodes were studied for pulse applications, comparing. the thermal characteristics of various commercial device construction techniques. The study considered temperature distribution effects resulting from nonuniform heat flow and power dissipation due to both perfect and imperfect die mounting. A testing technique is proposed which can accurately measure the average junction temperature as a function of time by monitoring the I-V operating point.
Keywords :
Copper; Flip chip; Heat sinks; Impedance measurement; Packaging; Schottky diodes; Semiconductor diodes; Silicon; Temperature; Time measurement;
Conference_Titel :
Reliability Physics Symposium, 1973. 11th Annual
Conference_Location :
Las Vegas, NV, USA
DOI :
10.1109/IRPS.1973.362607
