Title :
Metallurgical Aspects of Aluminum Wire Bonds to Gold Metallization
Author :
Newsome, James L. ; Oswald, Rudolph G. ; de Miranda, William R.Rodrigues
Author_Institution :
Honeywell Inc., Aerospace Division, 13350 U.S. Highway 19, St. Petersburg, Florida 33733
Abstract :
A study is made of the intermetallics which form when aluminum wire is ultrasonically joined to thin and thick film gold metallizations and stored for extended times at moderate temperatures. Conclusions are reached concerning the effects of conductor surface topography, thickness, and purity on bond reliability.
Keywords :
Aluminum; Electrical resistance measurement; Gold; Intermetallic; Metallization; Scanning electron microscopy; Substrates; Temperature; Thick films; Wire;
Conference_Titel :
Reliability Physics Symposium, 1976. 14th Annual
Conference_Location :
Las Vegas, NV, USA
DOI :
10.1109/IRPS.1976.362723
