Title :
Strain analysis of IC packages using a scanning Moire method
Author :
Zhong, Z.W. ; Nah, S.K.
Author_Institution :
Sch. of MPE, Nanyang Technol. Univ., Singapore, Singapore
Abstract :
This study investigates the thermal deformations of an electronics package using a SEM (scanning electron microscope) Moire method and compares the results with those obtained using an optical Moire method. The specimen used to obtain Moire fringes to evaluate thermal deformations was a flip-chip ball grid array (FCBGA) package. The shear strains in different solder joints were analysed using the SEM Moire method. The results were then compared to those obtained. using an optical Moire interferometry technique, and they coincided well. The scanning Moire technique can be a useful method for deformation study of a wide range of problems in deformation analysis. Deformation measurement with a high resolution is possible by using the SEM Moire technique. The advantages and disadvantages of a full field optical Moire, a micro optical Moire, and two scanning Moire methods are also compared in this paper.
Keywords :
ball grid arrays; deformation; flip-chip devices; integrated circuit packaging; integrated circuit testing; light interferometry; moire fringes; scanning electron microscopy; strain measurement; thermal stresses; FCBGA package; IC package strain analysis; Moire fringes; SEM; flip-chip ball grid array; micro optical Moire method; optical Moire interferometry; scanning Moire method; scanning Moire technique; scanning electron microscope; solder joint shear strain; thermal deformation; thermal mismatch; Capacitive sensors; Electronic packaging thermal management; Electronics packaging; Gratings; Integrated circuit packaging; Numerical analysis; Optical interferometry; Optical microscopy; Optical sensors; Scanning electron microscopy;
Conference_Titel :
Electronics Packaging Technology, 2003 5th Conference (EPTC 2003)
Print_ISBN :
0-7803-8205-6
DOI :
10.1109/EPTC.2003.1271497
