Title :
Evaluation of the ultra thin multi die outline (Ulthimo) concept as a package for high frequency transistors
Author :
De Samber, Marc ; Weekamp, Wim ; Yuan, Peter ; Caers, Jo ; Poi-Siong Teo ; Rotaru, M.D.
Author_Institution :
Center for Ind. Technol., Philips Electron., Netherlands
Abstract :
In electronic packaging for high frequency applications trends are miniaturisation (small footprint), optimised performance (low inductance leads), low cost, and mass fabrication potential. The so-called Ulthimo technology has been developed to meet these requirements. The construction being basically a moulded sandwich of a die clamped between a copper foil and connecting pads, it shows excellent high frequency properties and can be fabricated on matrix (plate size) level, yielding large numbers of packaged products from each processed plate.
Keywords :
UHF transistors; flip-chip devices; mass production; microassembling; microwave transistors; millimetre wave transistors; semiconductor device packaging; ultrasonic bonding; Ulthimo technology; die attach; electronic packaging; flip chip connection; high frequency transistors; low cost; low inductance leads; mass fabrication; miniaturisation; moulded sandwich; optimised performance; short connections; small footprint; thermal curing; ultrasonic bonding; ultrathin multi-die outline concept; Electronics industry; Electronics packaging; Fabrication; Frequency; Gold; Inductance; Industrial electronics; Lead; Protection; Sheet materials;
Conference_Titel :
Electronics Packaging Technology, 2003 5th Conference (EPTC 2003)
Print_ISBN :
0-7803-8205-6
DOI :
10.1109/EPTC.2003.1271503
