Title :
Accelerated-Test Procedures for Semiconductor Components
Author_Institution :
Post Office Research Centre, Martlesham Heath, Ipswich, IP5 7RE, England
Abstract :
The failure of semiconductor components is often accelerable by abnormal stresses, elevated temperature being the most successful although environmental humidity and excess current and voltage can be used selectively. In order to be useful for reliability prediction and user protection, the acquired data must be appropriately processed, recognizing, for example, the effect of competing failure mechanisms.
Keywords :
Acceleration; Hazards; Life estimation; Life testing; Lifetime estimation; Reliability engineering; Sampling methods; Statistical analysis; Statistical distributions; Stress;
Conference_Titel :
Reliability Physics Symposium, 1977. 15th Annual
Conference_Location :
LAs Vegas, NV, USA
DOI :
10.1109/IRPS.1977.362790