DocumentCode :
2607214
Title :
Accelerated-Test Procedures for Semiconductor Components
Author :
Reynolds, F.H.
Author_Institution :
Post Office Research Centre, Martlesham Heath, Ipswich, IP5 7RE, England
fYear :
1977
fDate :
28216
Firstpage :
166
Lastpage :
178
Abstract :
The failure of semiconductor components is often accelerable by abnormal stresses, elevated temperature being the most successful although environmental humidity and excess current and voltage can be used selectively. In order to be useful for reliability prediction and user protection, the acquired data must be appropriately processed, recognizing, for example, the effect of competing failure mechanisms.
Keywords :
Acceleration; Hazards; Life estimation; Life testing; Lifetime estimation; Reliability engineering; Sampling methods; Statistical analysis; Statistical distributions; Stress;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Reliability Physics Symposium, 1977. 15th Annual
Conference_Location :
LAs Vegas, NV, USA
ISSN :
0735-0791
Type :
conf
DOI :
10.1109/IRPS.1977.362790
Filename :
4208177
Link To Document :
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