Title :
Interface reactions in microelectronic solder joints and associated intermetallic compounds: an investigation of their mechanical properties using nanoindentation
Author :
Albrecht, H.J. ; Juritza, A. ; Müller, K. ; Müller, W.H. ; Sterthaus, J. ; Villain, J. ; Vogliano, A.
Author_Institution :
Siemens AG, Berlin, Germany
Abstract :
In this paper we present our results on how nanoindentation can serve for measurement of (local) mechanical properties in microelectronic materials and components. Special attention is paid to the properties of interface regions, i.e., the region of intermetallic bonds. Finally a finite element model is presented in order to simulate the full indentation process.
Keywords :
Vickers hardness; Young´s modulus; chemical interdiffusion; elastic moduli measurement; electronics packaging; finite element analysis; hardness testing; indentation; soldering; Vickers tests; Young´s modulus; bonded interfacial regions; finite element model; hardness; interface reactions; intermetallic bonds; intermetallic compounds; mechanical properties; microelectronic solder joints; nanoindentation; Bonding; Copper; Finite element methods; Gold; Intermetallic; Mechanical factors; Microelectronics; Nickel; Soldering; Testing;
Conference_Titel :
Electronics Packaging Technology, 2003 5th Conference (EPTC 2003)
Print_ISBN :
0-7803-8205-6
DOI :
10.1109/EPTC.2003.1271613
