Title :
X-Ray Radiographic Techniques in Failure Analysis
Author_Institution :
Hewlett-Packard Company, 3404 E. Harmony Road, Fort Collins, Colorado 80525
Abstract :
High resolution techniques in X-ray analysis are presented. These techniques are non-destructive and use inexpensive film such as Polaroid Type 52 and Type 55, with short exposure time. Examples are given using various common electrical and mechanical components such as semiconductors, variable resistors, fuses, connectors with the aid of a microfiche viewer.
Keywords :
Aerospace materials; Circuit testing; Failure analysis; Fuses; Lead; Microscopy; Pins; Radiography; Semiconductor films; X-ray imaging;
Conference_Titel :
Reliability Physics Symposium, 1982. 20th Annual
Conference_Location :
San Diego, NV, USa
DOI :
10.1109/IRPS.1982.363036
