Title :
Schrödinger-Poisson and Monte Carlo analysis of III–V MOSFETs for high frequency and low consumption applications
Author :
Shi, Ming ; Saint-Martin, Jérôme ; Bournel, Arnaud ; Dollfus, Philippe
Author_Institution :
IEF, Univ. Paris Sud, Orsay, France
Abstract :
III-V MOSFET (Metal Oxide Semiconductor Field Effect Transistor) with high-κ gate dielectric stack appears as a viable alternative to enhance not only microwave performance but also logic circuits with low supply voltage. This allows fulfilling high-speed and low-power specifications for intelligent applications. Indeed, combining weak gate leakage of standard MOSFETs and good RF performance of HEMTs (High Electron Mobility Transistors), they could outperform end-of-roadmap standard Si-MOSFET. Using full 2D Poisson-Schrödinger solver and a semi-classical Ensemble Monte Carlo device simulator, various 50nm MOSFET and HEMT are investigated in terms of gate charge control and both static and dynamic I-V performance. In particular, Y parameters are carefully extracted from time-varying currents. This comparative study allows us to propose an optimized III-V nano-FET architecture with high-frequency performance under low power supply.
Keywords :
III-V semiconductors; MOSFET; Monte Carlo methods; Poisson equation; Schrodinger equation; high electron mobility transistors; high-k dielectric thin films; logic circuits; low-power electronics; 2D Poisson-Schrodinger solver; HEMT; III-V MOSFET; III-V nano-FET architecture; Monte Carlo analysis; Schrodinger-Poisson analysis; dynamic current-voltage performance; high electron mobility transistors; high frequency application; high-K gate dielectric stack; logic circuits; low consumption application; metal oxide semiconductor field effect transistor; semiclassical ensemble Monte Carlo device simulator; size 50 nm; time-varying currents; Capacitance; Gain; HEMTs; Logic gates; MODFETs; MOSFETs; Performance evaluation;
Conference_Titel :
Simulation of Semiconductor Processes and Devices (SISPAD), 2010 International Conference on
Conference_Location :
Bologna
Print_ISBN :
978-1-4244-7701-2
Electronic_ISBN :
1946-1569
DOI :
10.1109/SISPAD.2010.5604563