Title :
Fuzzy process control of integrated circuit wire bonding
Author :
Kinnaird, Clark ; Khotanzad, Alireza
Author_Institution :
Dept. of Electr. Eng., Southern Methodist Univ., Dallas, TX, USA
Abstract :
The paper describes a fuzzy logic controller which sets parameters for the wire bonding process, specifically controlling bonded ball size and shear strength density. The design of the fuzzy engine and the development of rules based on operator experience are discussed. The controller has been tested on actual devices; results show improved process control
Keywords :
fuzzy control; fuzzy logic; integrated circuit manufacture; integrated circuit packaging; intelligent control; knowledge based systems; lead bonding; process control; shear strength; bonded ball size control; devices; fuzzy engine design; fuzzy logic controller; fuzzy process control; integrated circuit wire bonding; operator experience; rules; shear strength density control; Bonding processes; Fuzzy control; Fuzzy logic; Gold; Integrated circuit packaging; Mathematical model; Process control; Shape measurement; Size control; Wire;
Conference_Titel :
Fuzzy Information Processing Society, 1997. NAFIPS '97., 1997 Annual Meeting of the North American
Conference_Location :
Syracuse, NY
Print_ISBN :
0-7803-4078-7
DOI :
10.1109/NAFIPS.1997.624016
