Title :
Modeling soft error effects considering process variations
Author :
Zhao, Chong ; Dey, Sujit
Author_Institution :
Dept. of ECE, Univ. of California at San Diego, La Jolla, CA
Abstract :
This paper addresses the aggregated effects of two types of variations that contribute to the reliability degradation. The first one is the increasing level of process variation; the second one is one particular type of environmental variation - the radiation-induced soft error. Their simultaneous presence can cause large negative performance impact. We present a statistical approach to model the generation and propagation of a transient soft error inside combinational circuits considering the existence of inter-die channel length variation in CMOS digital circuits. Experiment results have demonstrated that channel length variation can significantly aggravate the soft error effect, which can be accurately evaluated using the proposed methodology.
Keywords :
CMOS integrated circuits; combinational circuits; integrated circuit modelling; integrated circuit reliability; statistical analysis; CMOS digital circuits; combinational circuits; inter-die channel length variation; modeling soft error effects; radiation-induced soft error; reliability degradation; statistical approach; transient soft error; CMOS digital integrated circuits; Combinational circuits; Degradation; Digital circuits; Logic devices; Logic gates; Random variables; Semiconductor device modeling; Single event upset; Very large scale integration;
Conference_Titel :
Computer Design, 2007. ICCD 2007. 25th International Conference on
Conference_Location :
Lake Tahoe, CA
Print_ISBN :
978-1-4244-1257-0
Electronic_ISBN :
1063-6404
DOI :
10.1109/ICCD.2007.4601927