DocumentCode :
2616734
Title :
Modeling of PGA lines considering electromagnetic coupling based on high frequency measurements
Author :
Winkel, T.-M.
Author_Institution :
Lab. fuer Informationstechnol., Hanover Univ., Germany
fYear :
1993
fDate :
20-22 Oct 1993
Firstpage :
228
Lastpage :
232
Abstract :
Electromagnetic coupling of pin-grid array (PGA) lines may cause problems in sensitive circuits. Models that are based upon measurements in a wide frequency range and which consider coupling effects are needed for the estimation of the electrical performance of a package. To enable high-frequency measurements of a four port device under test (DUT) with a two port network analyzer using microwave probes, a complex measurement setup including special contact structures is designed. The complete model of the DUT includes contact structures and lines on both the board, as well as on the chiplevel, the wirebond and pin grid array (PGA)-lines. The contact structures, lines and the wirebonds are modeled separately
Keywords :
S-parameters; UHF measurement; microwave measurement; packaging; 15 MHz to 3 GHz; PGA lines modelling; contact structures; electromagnetic coupling; four port device; high-frequency measurements; microwave probes; package electrical performance; two port network analyzer; Circuits; Contacts; Electromagnetic coupling; Electromagnetic measurements; Electromagnetic modeling; Electronics packaging; Frequency estimation; Frequency measurement; Microwave measurements; Semiconductor device measurement;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electrical Performance of Electronic Packaging, 1993
Conference_Location :
Monterey, CA
Print_ISBN :
0-7803-1427-1
Type :
conf
DOI :
10.1109/EPEP.1993.394548
Filename :
394548
Link To Document :
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