Title :
An integral equation approach to the prediction of the capacitance and the inductance of a via through-hole
Author :
Kok, Peter A. ; De Zutter, Daniël
Author_Institution :
Lab. of Electromagn. & Acoust., Ghent Univ., Belgium
Abstract :
A quasi-static method is described for calculating the excess capacitance and inductance of via´s. The considered via geometry contains connecting strips, pads on the via, and finite ground plane thickness. The influence of the pad size and the size of the ground plane opening on the via capacitance, inductance and impedance is examined
Keywords :
capacitance; inductance; integral equations; packaging; printed circuit design; connecting strips; ground plane thickness; impedance; integral equation approach; microstrip lines; numerical method; pad size; printed circuit board design; quasistatic method; via geometry; via through-hole capacitance; via through-hole inductance; Capacitance; Conductors; Dielectric substrates; Geometry; Inductance; Integral equations; Joining processes; Magnetostatics; Microstrip; Strips;
Conference_Titel :
Electrical Performance of Electronic Packaging, 1993
Conference_Location :
Monterey, CA
Print_ISBN :
0-7803-1427-1
DOI :
10.1109/EPEP.1993.394571
