• DocumentCode
    2620109
  • Title

    iNEMI’s gap analysis based on the 2007 electronics roadmap

  • Author

    Rae, Alan ; Pfahl, Robert C. ; Richardson, Charles

  • Author_Institution
    iNEMI 2214 Rock Hill Road, Suite 110, Herndon, Virginia 20170, USA
  • fYear
    2007
  • fDate
    3-5 Oct. 2007
  • Firstpage
    125
  • Lastpage
    134
  • Abstract
    Participants from almost every sector of the global electronics industry - 565 individuals from 17 countries - contributed to the 2007 iNEMI Roadmap and identified key gaps and challenges facing the electronics industry that could impede further development in critical areas. These gaps were parsed based on their tactical or strategic focus and the Research Committee and Technical Committee of iNEMI prioritized these gaps with the aim of highlighting research needs to the electronics community, academia and government. This presentation outlines the process, the identified gaps and recommendations for action.
  • Keywords
    Business; CMOS technology; Components, packaging, and manufacturing technology; Conferences; Consumer electronics; Costs; Driver circuits; Electronics industry; Government; Thermal management;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Advanced Packaging Materials: Processes, Properties, and Interfaces, 2007. APM 2007. 12th International Symposium on
  • Conference_Location
    San Jose, CA, USA
  • ISSN
    1550-5723
  • Print_ISBN
    978-1-4244-1338-6
  • Electronic_ISBN
    1550-5723
  • Type

    conf

  • DOI
    10.1109/ISAPM.2007.4419930
  • Filename
    4419930