DocumentCode
2620109
Title
iNEMI’s gap analysis based on the 2007 electronics roadmap
Author
Rae, Alan ; Pfahl, Robert C. ; Richardson, Charles
Author_Institution
iNEMI 2214 Rock Hill Road, Suite 110, Herndon, Virginia 20170, USA
fYear
2007
fDate
3-5 Oct. 2007
Firstpage
125
Lastpage
134
Abstract
Participants from almost every sector of the global electronics industry - 565 individuals from 17 countries - contributed to the 2007 iNEMI Roadmap and identified key gaps and challenges facing the electronics industry that could impede further development in critical areas. These gaps were parsed based on their tactical or strategic focus and the Research Committee and Technical Committee of iNEMI prioritized these gaps with the aim of highlighting research needs to the electronics community, academia and government. This presentation outlines the process, the identified gaps and recommendations for action.
Keywords
Business; CMOS technology; Components, packaging, and manufacturing technology; Conferences; Consumer electronics; Costs; Driver circuits; Electronics industry; Government; Thermal management;
fLanguage
English
Publisher
ieee
Conference_Titel
Advanced Packaging Materials: Processes, Properties, and Interfaces, 2007. APM 2007. 12th International Symposium on
Conference_Location
San Jose, CA, USA
ISSN
1550-5723
Print_ISBN
978-1-4244-1338-6
Electronic_ISBN
1550-5723
Type
conf
DOI
10.1109/ISAPM.2007.4419930
Filename
4419930
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