DocumentCode :
262225
Title :
12.4 A 1mm-pitch 80×80-channel 322Hz-frame-rate touch sensor with two-step dual-mode capacitance scan
Author :
Miura, Naruhisa ; Dosho, S. ; Takaya, Satoshi ; Fujimoto, Daisuke ; Kiriyama, Takumi ; Tezuka, Hiroyuki ; Miki, T. ; Yanagawa, Hiroto ; Nagata, M.
Author_Institution :
Kobe Univ., Kobe, Japan
fYear :
2014
fDate :
9-13 Feb. 2014
Firstpage :
216
Lastpage :
217
Abstract :
A 1mm-pitch 80×80-channel 322Hz-frame-rate touch sensor is reported. Multiple touch points are detected by a two-step dual-mode capacitance scan, where self- and mutual-capacitance measurements are hierarchically performed in two steps to reduce scan time that is otherwise increased due to high resolution. 160 dedicated row and column ADCs are used for the parallel read-out to further reduce scan time. A time-domain digital conversion that uses a counter-based slope ADC significantly reduces power and area for the parallel ADC approach. The signal attenuation due to the sensor capacitance reduction in the 1mm fine-pitch electrode is compensated by using thorough noise-reduction techniques in the sensor analog front-end (AFE). A 0.35μm CMOS prototype demonstrates 41dB SNR with >3× higher pitch resolution, >10× faster touch-point scan, 12× and 4× higher energy and area efficiency compared to state-of-the-art touch sensors [1,2].
Keywords :
CMOS integrated circuits; analogue-digital conversion; capacitance measurement; tactile sensors; time-domain analysis; AFE; column ADC; counter-based slope ADC; fine-pitch electrode; frequency 322 Hz; mutual-capacitance measurements; noise-reduction techniques; parallel ADC approach; parallel readout; row ADC; scan time; self-capacitance measurements; sensor analog front-end; sensor capacitance reduction; signal attenuation; size 0.35 mum; time-domain digital conversion; touch points; touch sensor; two-step dual-mode capacitance scan; Capacitance; Capacitive sensors; Choppers (circuits); Electrodes; Noise; Tactile sensors;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Solid-State Circuits Conference Digest of Technical Papers (ISSCC), 2014 IEEE International
Conference_Location :
San Francisco, CA
ISSN :
0193-6530
Print_ISBN :
978-1-4799-0918-6
Type :
conf
DOI :
10.1109/ISSCC.2014.6757406
Filename :
6757406
Link To Document :
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