Title :
Table of contents
Abstract :
The following topics are dealt with: interconnect modeling; power integrity; frequency domain simulation; parameter extraction; interconnect measurement; interconnect reliability; model order reduction; interconnect technologies; signal integrity; EMC; and macromodeling.
Keywords :
integrated circuit interconnections; integrated circuit measurement; integrated circuit modelling; integrated circuit reliability; EMC; frequency domain simulation; interconnect measurement; interconnect reliability; interconnection modeling; macromodeling; model order reduction; parameter extraction; power integrity; signal integrity;
Conference_Titel :
Signal Propagation on Interconnects (SPI), 2010 IEEE 14th Workshop on
Conference_Location :
Hildesheim
Print_ISBN :
978-1-4244-7611-4
DOI :
10.1109/SPI.2010.5483600
