• DocumentCode
    2632833
  • Title

    Geometry variations analysis of TiO2 thin-film and spintronic memristors

  • Author

    Hu, Miao ; Li, Hai ; Chen, Yiran ; Wang, Xiaobin ; Pino, Robinson E.

  • Author_Institution
    Dept. of ECE, Polytech. Inst. of NYU, Brooklyn, OH, USA
  • fYear
    2011
  • fDate
    25-28 Jan. 2011
  • Firstpage
    25
  • Lastpage
    30
  • Abstract
    The fourth passive circuit element, memristor, has attracted increased attentions since the first real device was discovered by HP Lab in 2008. Its distinctive characteristic to record the historic profile of the voltage/current through itself creates great potentials in future system design. However, as a nano-scale device, memristor is facing great challenge on process variation control in the manufacturing. In this work, we analyze the impact of the geometry variations on the electrical properties of both TiO2 thin-film and spintronic memristors, including line edge roughness and thickness fluctuation. A simple algorithm was proposed to generate a large volume of geometry variation-aware three-dimensional device structures for Monte-Carlo simulations. Our simulation results show that due to the different physical mechanisms, TiO2 thin-film memristor and spintronic memristor demonstrate very different electrical characteristics even when exposing them to the same excitations and under the same process variation conditions.
  • Keywords
    Monte Carlo methods; geometry; magnetoelectronics; memristors; nanoelectronics; passive networks; thin film devices; titanium compounds; Monte-Carlo simulation; TiO2; electrical property; geometry variations analysis; line edge roughness; nano-scale device; passive circuit element; process variation control; spintronic memristor; thickness fluctuation; thin-film; three-dimensional device structure; Doping; Electrodes; Fluctuations; Geometry; Magnetoelectronics; Memristors; Resistance;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Design Automation Conference (ASP-DAC), 2011 16th Asia and South Pacific
  • Conference_Location
    Yokohama
  • ISSN
    2153-6961
  • Print_ISBN
    978-1-4244-7515-5
  • Type

    conf

  • DOI
    10.1109/ASPDAC.2011.5722193
  • Filename
    5722193