DocumentCode
2633124
Title
Thermal models for semiconductors
Author
van Duijsen, Peter ; Bauer, Pavol ; Leuchter, Jan
Author_Institution
Simulation Res., Alphen aan den Rijn, Netherlands
fYear
2010
fDate
6-8 Sept. 2010
Abstract
The power electronics circuits are seriously limited by the thermal ambience and therefore a detailed thermal design on power electronics is desirable. Especially the semiconductors are vulnerable to a high temperature and thermal cycling. The overview of power semiconductors switches as an effects of temperature are shown in this paper. In this paper the combined modeling and simulation of electrical and thermal behavior of semiconductors is discussed. The models for the semiconductors, being the MOSFET, IGBT and DIODE are briefly introduced and their most important parameters are highlighted. The thermal models for all semiconductors are discussed and how they are connected to the semiconductors. A series of measurements are shown for the MOSFET, IGBT and DIODE and these results are compared with simulations.
Keywords
insulated gate bipolar transistors; power MOSFET; power semiconductor diodes; power semiconductor switches; semiconductor device models; IGBT; MOSFET; diode; electrical behavior; power electronics circuits; power semiconductor switches; semiconductors; thermal ambience; thermal models; Insulated gate bipolar transistors; Integrated circuit modeling; MOSFET circuits; Schottky diodes; Switches; Modelling; Power semiconductor device; Thermal design;
fLanguage
English
Publisher
ieee
Conference_Titel
Power Electronics and Motion Control Conference (EPE/PEMC), 2010 14th International
Conference_Location
Ohrid
Print_ISBN
978-1-4244-7856-9
Type
conf
DOI
10.1109/EPEPEMC.2010.5606875
Filename
5606875
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