Session Abstract

Today¿s wafer manufacturing facilities generate large amounts of electrical test and process data. Traditionally this data has been collected, stored and analyzed to identify sources of yield loss and continually provide real-time characterization of the manufacturing process itself. In-line inspections, parametric tests and CD, film thickness and metal overlay measurements occur at numerous points during wafer processing. This data is analyzed correlated and displayed in many forms including charts, tables and wafer/die maps. Ultimately, these capabilities lead to the identification and capture of an abnormality on the wafer with an FA imaging tool.