DocumentCode :
2635925
Title :
Origami-like folded mems for realization of TIMU: fabrication technology and initial demonstration
Author :
Efimovskaya, Alexandra ; Senkal, Doruk ; Askari, Sina ; Shkel, Andrei M.
Author_Institution :
Microsyst. Lab., Univ. of California, Irvine, Irvine, CA, USA
fYear :
2015
fDate :
23-26 March 2015
Firstpage :
1
Lastpage :
4
Abstract :
This paper reports a prototype of miniature, <;50 mm3, Timing and Inertial Measurement Unit (TIMU), implemented utilizing a Folded MEMS concept. The approach is based on a wafer-level fabrication of high aspect ratio single-axis sensors, interconnected by flexible polyimide hinges, and then folded into a 3-D configuration, typically in a shape of cube or prism. Co-fabricated thru-wafer interconnects enable interfacing sensors on the device side of the TIMU with signal conditioning electronics potentially integrated inside a folded 3-D structure. We report a TIMU prototype with all 7 sensors operational, thus demonstrating a feasibility of the proposed fabrication approach. In this paper, we emphasize the characterization of the low-noise accelerometers, implemented on the TIMU sidewalls, demonstrating VRW of 0.057 m=s2= p h and bias instability of <;0.2 mg.
Keywords :
accelerometers; flexible electronics; integrated circuit interconnections; microsensors; prototypes; signal conditioning circuits; wafer level packaging; TIMU prototype; flexible polyimide hinges; high aspect ratio single-axis sensors; low-noise accelerometers; origami-like folded MEMS; signal conditioning electronics; thru-wafer interconnects; timing and inertial measurement unit; wafer-level fabrication; Accelerometers; Fabrication; Gyroscopes; Integrated circuit interconnections; Micromechanical devices; Prototypes; Sensors;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Inertial Sensors and Systems (ISISS), 2015 IEEE International Symposium on
Conference_Location :
Hapuna Beach, HI
Type :
conf
DOI :
10.1109/ISISS.2015.7102373
Filename :
7102373
Link To Document :
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