2638448

Electrical performance evaluation for multi-chip assemblies using knowledge based approach

Hsu, Pochang ; Senthinathan, R. ; Rozenblit, J.W. ; Prince, John L.

Center for Electronic Packaging Research, Department of Electrical and Computer Engineering, University of Arizona, Tucson, Arizona 85721

1992

22-24 Apr 1992

7

9

Artificial intelligence; Assembly; Bonding; CMOS technology; Delay estimation; Electronics packaging; Frequency; Object oriented modeling; Power dissipation; Thermal resistance;

English

ieee

Electrical Performance of Electronic Packaging, 1992

0-7803-0683-X

conf

10.1109/EPEP.1992.572250

572250