Title :
Design of thin-film AlN actuators for 4-inch transparent plates for haptic applications
Author :
Casset, F. ; Danel, Js ; Chappaz, C. ; Bernard, F. ; Basrour, S. ; Desloges, B. ; Fanget, S.
Author_Institution :
LETI, CEA, Grenoble, France
Abstract :
Numerous applications require tactile interfaces today. In particular, many customers´ applications such as Smartphone, tablet PC or touch pad can be concerned by high performances, low voltage haptic interfaces which allow the user to interact with its environment by the sense of touch. This technology is already used but with limitations such as high power consumption and limited feedback effect (simple vibration). We chose to work on the squeeze-film effect. It consists in changing the friction between the finger and a plate resonator. It provides high granularity level of haptic sensation. This paper deals with the design of high performances actuators in order to promote the squeeze-film effect on a 4-inch plate (diagonal of the plate). Using predictive models, we select the best design, able to generate the highest substrate displacement amplitude as possible. We built demonstrators using a generic technology based on thin-film AlN actuators. Electromechanical characterization is ongoing before the integration of the thin-film actuator plate in a haptic demonstrator in a close future.
Keywords :
aluminium compounds; finite element analysis; haptic interfaces; low-power electronics; piezoelectric actuators; thin film devices; electromechanical characterization; feedback effect; friction; granularity level; haptic application; haptic demonstrator; haptic sensation; high performances actuator; low voltage haptic interfaces; plate resonator; power consumption; smartphone; squeeze-film effect; substrate displacement amplitude; tablet PC; tactile interface; thin-film actuator plate; thin-film aluminum nitride actuator; touch pad; transparent plate; Actuators; Electric variables measurement; Glass; Measurement by laser beam; Thickness measurement; Transducers;
Conference_Titel :
Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2015 16th International Conference on
Conference_Location :
Budapest
Print_ISBN :
978-1-4799-9949-1
DOI :
10.1109/EuroSimE.2015.7103089