DocumentCode :
2641613
Title :
Experimental investigation on the impulse force characteristics in EIDI system
Author :
Guangchao, Li ; Jiang, He ; Guiping, Lin
Author_Institution :
Sch. of Aeronaut. Sci. & Eng., Beihang Univ., Beijing, China
fYear :
2011
fDate :
21-23 June 2011
Firstpage :
2558
Lastpage :
2562
Abstract :
Electro-impulse de-icing (EIDI) system has become one of the important part of aviation de-icing technology, because of its advantages in low power consumption, light weight, convenient maintenance, well reliability, little expense and so on. Electrodynamics analysis is the fundamental basis of the EIDI system design, providing impulse force characteristics for the ensuing stage of structural dynamics analysis and icing region prediction. Since electrodynamics analysis deals with the coupling of electric field, magnetic field and structure deformation, it is incontinent to setup mathematical-physical model close to reality. Therefore, the present work developed a prototype of EIDI system, and investigated the impulse force characteristics experimentally. The feasibility and validity of the EIDI prototype has been verified, and the effect of charging voltage, coil-to-skin gap, skin thickness and conductivity onto the maximum impulse force with has been studied. Moreover, a correlation between the maximum impulse force and the induced peak current intensity is proposed.
Keywords :
aircraft; electric fields; electrodynamics; magnetic fields; EIDI system; aviation deicing technology; charging voltage; coil-to-skin gap; conductivity; electric field; electro-impulse deicing; electrodynamics analysis; icing region prediction; impulse force characteristic; magnetic field; peak current intensity; skin thickness; structural dynamics analysis; structure deformation; Aircraft; Coils; Correlation; Force; Metals; Prototypes; Skin; electric impulse deicing system; electrodynamics analysis; impulse force; piezoelectric force sensor;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Industrial Electronics and Applications (ICIEA), 2011 6th IEEE Conference on
Conference_Location :
Beijing
ISSN :
pending
Print_ISBN :
978-1-4244-8754-7
Electronic_ISBN :
pending
Type :
conf
DOI :
10.1109/ICIEA.2011.5976024
Filename :
5976024
Link To Document :
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