DocumentCode
2641933
Title
Techniques for electromagnetic modeling and simulation of electronic packages - a review
Author
Mittra, Raj
Author_Institution
Electromagnetic Communication Laboratory, University of Illinois, Urbana, IL 61801-2991
fYear
1992
fDate
22-24 Apr 1992
Firstpage
69
Lastpage
69
Keywords
Circuit simulation; Computational modeling; Computer simulation; Distributed parameter circuits; Electromagnetic modeling; Electronics packaging; Integrated circuit interconnections; Microstrip; Stripline; Transmission line discontinuities;
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical Performance of Electronic Packaging, 1992
Print_ISBN
0-7803-0683-X
Type
conf
DOI
10.1109/EPEP.1992.572267
Filename
572267
Link To Document