DocumentCode
2641990
Title
Material characterization and process optimization of dye-sensitized solar cell sealant
Author
Changwoon Han ; Park, Seungil
Author_Institution
Korea Electron. Technol. Inst., Seongnam, South Korea
fYear
2015
fDate
19-22 April 2015
Firstpage
1
Lastpage
4
Abstract
Large-scaled dye-sensitized solar cell (DSC) modules are recently developed for building-integrated photovoltaic (BIPV) applications. In the modules, two glasses with electrodes and dye are sealed together to prevent the leakage of liquid electrolyte. It is known that DSC modules deteriorate rapidly under high temperature conditions. Previous studies showed that expansion of liquid electrolyte in the module is the main reason for the degradation; the expansion of electrolyte induces the breakage of sealant material of DSC module in high temperature. This study investigates how the sealant curing process affects the integrity of DSC module in high temperature. Sealant samples are made up by several UV curing times. Shadow moiré technique is used to measure the coefficient of thermal expansion (CTE) of the sealant samples. With the test results, finite element analyses are conducted to optimize the curing process time. It is finally suggested that the longer the curing time, the more robust the DSC module.
Keywords
building integrated photovoltaics; curing; dye-sensitised solar cells; electrochemical electrodes; electrolytes; sealing materials; thermal expansion; ultraviolet spectra; BIPV applications; CTE; building-integrated photovoltaic applications; coefficient of thermal expansion; dye-sensitized solar cell sealant process optimization; electrodes; finite element analyses; large-scaled DSC module sealant material breakage; liquid electrolyte leakage prevention; sealant UV curing process; Cameras; Curing; Reliability; Sealing materials; Temperature measurement;
fLanguage
English
Publisher
ieee
Conference_Titel
Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2015 16th International Conference on
Conference_Location
Budapest
Print_ISBN
978-1-4799-9949-1
Type
conf
DOI
10.1109/EuroSimE.2015.7103118
Filename
7103118
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