• DocumentCode
    2641990
  • Title

    Material characterization and process optimization of dye-sensitized solar cell sealant

  • Author

    Changwoon Han ; Park, Seungil

  • Author_Institution
    Korea Electron. Technol. Inst., Seongnam, South Korea
  • fYear
    2015
  • fDate
    19-22 April 2015
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    Large-scaled dye-sensitized solar cell (DSC) modules are recently developed for building-integrated photovoltaic (BIPV) applications. In the modules, two glasses with electrodes and dye are sealed together to prevent the leakage of liquid electrolyte. It is known that DSC modules deteriorate rapidly under high temperature conditions. Previous studies showed that expansion of liquid electrolyte in the module is the main reason for the degradation; the expansion of electrolyte induces the breakage of sealant material of DSC module in high temperature. This study investigates how the sealant curing process affects the integrity of DSC module in high temperature. Sealant samples are made up by several UV curing times. Shadow moiré technique is used to measure the coefficient of thermal expansion (CTE) of the sealant samples. With the test results, finite element analyses are conducted to optimize the curing process time. It is finally suggested that the longer the curing time, the more robust the DSC module.
  • Keywords
    building integrated photovoltaics; curing; dye-sensitised solar cells; electrochemical electrodes; electrolytes; sealing materials; thermal expansion; ultraviolet spectra; BIPV applications; CTE; building-integrated photovoltaic applications; coefficient of thermal expansion; dye-sensitized solar cell sealant process optimization; electrodes; finite element analyses; large-scaled DSC module sealant material breakage; liquid electrolyte leakage prevention; sealant UV curing process; Cameras; Curing; Reliability; Sealing materials; Temperature measurement;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2015 16th International Conference on
  • Conference_Location
    Budapest
  • Print_ISBN
    978-1-4799-9949-1
  • Type

    conf

  • DOI
    10.1109/EuroSimE.2015.7103118
  • Filename
    7103118