DocumentCode
2643796
Title
Analysis and optimization of differential PCB traces
Author
Xu, Buli ; Tang, Sungyen ; Chen, Yinchao ; McDonough, Tom
Author_Institution
Dept. of Electr. Eng., Univ. of South Carolina, Columbia, SC, USA
fYear
2009
fDate
1-5 June 2009
Firstpage
1
Lastpage
4
Abstract
High-speed data transmission can suffer significant degradation after the signal has passed through a long transmission path. Proper design of PCB differential transmission pairs is one of the most important steps in creating a reliable serial ATA link. Based on a typical Intel 8-layer stackup, a design of 100 Omega microstrip and stripline differential pairs using empirical formulas and a 3D full-wave field solver is outlined in this paper.
Keywords
microstrip lines; printed circuits; transmission lines; 3D full-wave field solver; Intel 8-layer stackup; differential PCB traces; empirical formulas; high-speed data transmission; microstrip differential pairs; resistance 10 ohm; serial ATA link; stripline differential pairs; Data communication; Degradation; Dielectrics; Frequency estimation; Impedance; Microstrip; Routing; Signal analysis; Stripline; Transmission lines;
fLanguage
English
Publisher
ieee
Conference_Titel
Antennas and Propagation Society International Symposium, 2009. APSURSI '09. IEEE
Conference_Location
Charleston, SC
ISSN
1522-3965
Print_ISBN
978-1-4244-3647-7
Type
conf
DOI
10.1109/APS.2009.5171510
Filename
5171510
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