Title :
Near-field wireless connection for 3D-system integration
Author :
Kuroda, Tadahiro
Author_Institution :
Keio Univ., Yokohama, Japan
Abstract :
This paper describes a wireless inter-chip link using inductive coupling, namely ThruChip Interface (TCI). TCI is a digital CMOS circuit solution in a standard CMOS technology. It is less expensive than TSV but bears comparison in performance.
Keywords :
CMOS integrated circuits; radiofrequency integrated circuits; three-dimensional integrated circuits; 3D-system integration; CMOS circuit solution technology; TCI; TSV; ThruChip interface; inductive coupling; near-field wireless connection; wireless inter-chip link; Bandwidth; CMOS integrated circuits; Coils; Couplings; Through-silicon vias; Very large scale integration; Wireless communication; 3D IC; inductive coupling; near field;
Conference_Titel :
VLSI Technology (VLSIT), 2012 Symposium on
Conference_Location :
Honolulu, HI
Print_ISBN :
978-1-4673-0846-5
Electronic_ISBN :
0743-1562
DOI :
10.1109/VLSIT.2012.6242483
