DocumentCode :
2648416
Title :
Application of fault simulation test in the VLSI failure analysis
Author :
Lin, Xiaoling ; Xiao, Qingzhong ; Yao, Ruohe
Author_Institution :
Nat. Key Lab. of Sci. & Technol., China Electron. Product Reliability & Environ. Testing Res. Inst., Guangzhou, China
fYear :
2011
fDate :
17-19 June 2011
Firstpage :
312
Lastpage :
315
Abstract :
Purpose of VLSI failure analysis is to find effective measure to eliminate or reduce the same failure to happen again. But failure mechanism or failure mode of VLSI is variety. If the VLSI failure analyzer can not find out the root cause, wrong prevention method may be adapted and failure may still happen next time. This paper introduces fault simulation test, which is an effective way to distinguish the similar failure mechanism and confirm the failure mode, such as latch-up effect, electric over stress (EOS), etc. It can provide useful reference information for the users or producers. At the same time, several typical failure analysis cases are used to show how the fault simulation test works.
Keywords :
VLSI; failure analysis; VLSI failure analysis; electric over stress; failure mode; fault simulation test; latch-up effect; Circuit faults; Contamination; Failure analysis; Integrated circuit modeling; Pulse width modulation; Reliability; Very large scale integration; contamination; failure analysis; fault simulation test; latch-up;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Quality, Reliability, Risk, Maintenance, and Safety Engineering (ICQR2MSE), 2011 International Conference on
Conference_Location :
Xi´an
Print_ISBN :
978-1-4577-1229-6
Type :
conf
DOI :
10.1109/ICQR2MSE.2011.5976619
Filename :
5976619
Link To Document :
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