DocumentCode :
2651807
Title :
The design and test of an MCM-D RF front end for HIPERLAN
Author :
Arnold, R.G. ; Faulkner, C.C. ; Pedder, D.J.
Author_Institution :
Mitel Semicond., Swindon, UK
fYear :
1998
fDate :
35920
Firstpage :
42552
Lastpage :
42557
Abstract :
Under the “Hiperion” ESPRIT project, an integrated MCM-D RF front end module for use in the HIPERLAN band has been designed and tested. The module integrates all functions needed to interface between the 5.2 GHz RF band and a 700 MHz IF both in transmit and in receive into a ceramic ball grid array package just 17 mm square. The design uses custom GaAs MMICs, a bipolar silicon prescaler and discrete HEMT transistors, together with filters and matching components realised using embedded passive components within the MCM-D substrate. The design and test of the module is described, together with a revised implementation which uses flipchip ICs and a technique known as direct module attach whereby the module may be directly mounted onto a printed circuit board without the need for a further package
Keywords :
multichip modules; 5.2 GHz; 700 MHz; ESPRIT project; GaAs; HIPERLAN; Hiperion; MCM-D RF front end; ceramic ball grid array package; direct module attach; discrete HEMT transistors; flipchip ICs; matching components; prescaler;
fLanguage :
English
Publisher :
iet
Conference_Titel :
Multi-Chip Modules and RFICs (Ref. No. 1998/231), IEE Colloquium on
Conference_Location :
London
Type :
conf
DOI :
10.1049/ic:19980203
Filename :
710424
Link To Document :
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