DocumentCode :
2652632
Title :
Integrated power packaging: trends, driving forces, and restraints
Author :
Fishbein, Jeff
Author_Institution :
Commercial Integrated Power Eng., Int. Rectifier Corp., El Segundo, CA, USA
fYear :
1994
fDate :
20-21 Oct 1994
Firstpage :
3
Lastpage :
15
Abstract :
Movement toward integrated power packaging has been occurring for well over a decade. In the past few years in particular, with growing interest in value added and the attention being paid to true system cost, integrated power packaging is broadening in appeal in all major market segments. This approach competes with the traditional discrete component solutions. This paper reviews trends that are contributing to this growing interest and forces pushing for implementation. Also, obstacles inhibiting realization are explored
Keywords :
circuit reliability; economics; power electronics; semiconductor device manufacture; semiconductor device packaging; assembly trends; company culture; culture trends; economics; integrated power packaging; package size; package weight; power electronics; reliability; system cost; time factors; Current density; Insulated gate bipolar transistors; Low voltage; MOSFETs; Power semiconductor switches; Schottky diodes; Semiconductor device packaging; Semiconductor devices; Semiconductor diodes; Substrates;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Power Electronics in Transportation, 1994. [Proceedings]
Conference_Location :
Dearborn, MI
Print_ISBN :
0-7803-1839-0
Type :
conf
DOI :
10.1109/PET.1994.572350
Filename :
572350
Link To Document :
بازگشت