Title :
Experimental studies on bonding pressure in wire bonding
Author :
Gao, Rongzhi ; Han, Lei ; Zhong, Jue
Author_Institution :
Central South Univ., Changsha
Abstract :
The bonding pressure is one of the most important factors to the bonding strength in ultrasonic wire bonding. The relations between bonding pressure and bonding strength of 0.3 mm Al wire were experimentally studied. The bonding pressure of the U3000 ultrasonic wedge bonder was calibrated; the influence on the voltage, current was studied. The result show that only moderate conditions of bonding pressure leads to the largest bonding strength
Keywords :
aluminium; lead bonding; mechanical strength; ultrasonic bonding; 3 mm; Al; U3000 ultrasonic wedge bonder; aluminum wire; bonding pressure; bonding strength; ultrasonic wire bonding; Aluminum; Bonding forces; Frequency; Magnetic forces; Phase locked loops; Seals; Ultrasonic transducers; Vibrations; Voltage; Wire;
Conference_Titel :
High Density Microsystem Design and Packaging and Component Failure Analysis, 2006. HDP'06. Conference on
Conference_Location :
Shanghai
Print_ISBN :
1-4244-0488-6
DOI :
10.1109/HDP.2006.1707578
