DocumentCode :
2657016
Title :
Development and prototyping of a HB-LED array module for indoor solid state lighting
Author :
Lee, S. W Ricky ; Lau, C.H. ; Chan, S.P. ; Ma, K.Y. ; Ng, M.H. ; Ng, Y.W. ; Lee, K.H. ; Lo, Jeffery C C
Author_Institution :
Dept. of Mech. Eng., Hong Kong Univ. of Sci. & Technol., Kowloon
fYear :
2006
fDate :
27-28 June 2006
Firstpage :
141
Lastpage :
145
Abstract :
Light emitting diodes (LEDs) have been widely used for a long period of time in various applications such as instrumentation signals, message displays, traffic signals, decoration and personal lighting. With the increase in power rating and the improvement in optical efficiency, LEDs have demonstrated high potential for general lighting applications. In recent years, people became interested in using high brightness LEDs (HB-LEDs) as light sources to replace conventional fluorescent light tubes and lamps. Industrial forecasting indicated that the luminous efficiency of HB-LEDs will be greatly improved in the near future. In addition to increasing luminous efficiency, HB-LEDs have other advantages such as ultra long life, relatively low power consumption, and no UV radiation. These superior properties give HB-LEDs an extra edge over conventional lighting sources. In this study, the coating process for generating white light from blue LEDs was investigated. Furthermore, a prototype of HB-LED array module was fabricated to demonstrate the feasibility of such a lighting device. The outcome of the present study shows that HB-LED array modules should have good potential to replace conventional fluorescent light tubes for indoor solid state lighting (SSL)
Keywords :
LED lamps; brightness; light sources; HB-LED array module; blue LED; coating process; high brightness LED; indoor solid state lighting; light emitting diodes; light sources; luminous efficiency; white light generation; Brightness; Displays; Instruments; LED lamps; Light emitting diodes; Light sources; Optical arrays; Prototypes; Solid state lighting; Stimulated emission;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
High Density Microsystem Design and Packaging and Component Failure Analysis, 2006. HDP'06. Conference on
Conference_Location :
Shanghai
Print_ISBN :
1-4244-0488-6
Type :
conf
DOI :
10.1109/HDP.2006.1707581
Filename :
1707581
Link To Document :
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