DocumentCode :
2657069
Title :
Wet etched complex three dimensional MEMS structures
Author :
Pal, Prem ; Sato, Kazuo
Author_Institution :
Dept. of Micro-Nano Syst. Eng., Nagoya Univ., Nagoya, Japan
fYear :
2009
fDate :
9-11 Nov. 2009
Firstpage :
553
Lastpage :
558
Abstract :
The present research reports the fabrication techniques for the formation of complex three dimensional structures. The process is developed using very economic wet anisotropic etching in pure and surfactant Triton X-100 [C14H22O(C2H4O)n, n= 9-10] added 25 wt% tetramethyl ammonium hydroxide (TMAH) solutions. The structures are fabricated in single and nitride-based silicon on insulator (SOI) Si{100} wafers. In single wafer, both fixed and suspended structures are manufactured, while in SOI wafers only freestanding structures are realized. The present research is aimed to enhance the range of 3D structures fabricated using wet etching.
Keywords :
carbon compounds; etching; integrated circuit manufacture; micromachining; micromechanical devices; surfactants; CHO; bulk micromachining; complex three dimensional structures; fabrication techniques; insulator wafers; nitride-based silicon; surfactant Triton X-100; tetramethyl ammonium hydroxide solutions; wet anisotropic etching; Anisotropic magnetoresistance; Fabrication; Manufacturing; Micromachining; Micromechanical devices; Oxidation; Shape; Silicon on insulator technology; Systems engineering and theory; Wet etching;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Micro-NanoMechatronics and Human Science, 2009. MHS 2009. International Symposium on
Conference_Location :
Nagoya
Print_ISBN :
978-1-4244-5094-7
Electronic_ISBN :
978-1-4244-5095-4
Type :
conf
DOI :
10.1109/MHS.2009.5351788
Filename :
5351788
Link To Document :
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