Title :
Wafer-level chip scale MEMS oscillator for wireless applications
Author :
Kuypers, J.H. ; Zolfagharkhani, G. ; Gaidarzhy, A. ; Thalmayr, F. ; Sparks, A. ; Chen, D.M. ; Rebel, R. ; Newman, B. ; Asmani, M. ; Badillo, D. ; Schoepf, K.J.
Author_Institution :
Sand 9, Inc., Cambridge, MA, USA
Abstract :
This invited paper presents the first chip-scale packaged MEMS oscillator solution that meets the stringent requirements for cellular applications. The temperature compensated MEMS oscillator (TCMO™) meets the frequency stability requirement of ±2.5 ppm from -30°C to +85°C, phase noise of -130 dBc/Hz at 1 kHz for a 13 MHz carrier, start-up time of below 2.5 ms and current consumption of less than 5 mA. With dimensions of 1.44×1.04×0.55 mm3 the MEMS oscillator requires less than half the volume of the smallest 2016 TCXO. Importantly, due to the hermetic chip-scale package it can be integrated with larger ICs and SAW/BAW components into larger overmolded modules.
Keywords :
bulk acoustic wave devices; cellular radio; chip scale packaging; compensation; frequency stability; micromechanical devices; oscillators; surface acoustic waves; wafer level packaging; SAW-BAW components; cellular application; current consumption; frequency 13 MHz; frequency stability requirement; hermetic chip-scale package; temperature -30 degC to 85 degC; temperature-compensated MEMS oscillator; wafer-level chip scale-packaged MEMS oscillator; wireless application; Crystals; Micromechanical devices; Phase noise; Resonant frequency; Thermal stability; Time frequency analysis;
Conference_Titel :
Frequency Control Symposium (FCS), 2012 IEEE International
Conference_Location :
Baltimore, MD
Print_ISBN :
978-1-4577-1821-2
DOI :
10.1109/FCS.2012.6243689
