DocumentCode :
2660409
Title :
Gate I-V characteristics degradation in AlGaN/AlN/GaN HEMTs
Author :
Li, Lingjia ; Skowronski, Marek
Author_Institution :
Carnegie Mellon Univ., Pittsburgh
fYear :
2007
fDate :
12-14 Dec. 2007
Firstpage :
1
Lastpage :
2
Abstract :
AlGaN/AlN/GaN high electron mobility transistor (HEMT) is one of the most promising device structures for high frequency power applications. Although high power density was demonstrated by number of groups [1], several unresolved issues remain. One of them is the gate breakdown under forward bias. Figure 1 shows the typical gate I-V characteristics of the devices obtained by applying voltage (Vg) between gate and drain with source floating. At certain voltage (4.5-6 V), the gate current (Ig) increases instantaneously. The change is permanent with current in both forward and reverse direction increased by several orders of magnitude.
Keywords :
III-V semiconductors; aluminium compounds; gallium compounds; high electron mobility transistors; wide band gap semiconductors; AlGaN-AlN-GaN; HEMT; gate IV characteristics degradation; high electron mobility transistor; high frequency power applications; Aluminum gallium nitride; Degradation; Educational institutions; Electric breakdown; Electron beams; Gallium nitride; HEMTs; MODFETs; Transmission electron microscopy; Voltage;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Semiconductor Device Research Symposium, 2007 International
Conference_Location :
College Park, MD
Print_ISBN :
978-1-4244-1891-6
Electronic_ISBN :
978-1-4244-1892-3
Type :
conf
DOI :
10.1109/ISDRS.2007.4422462
Filename :
4422462
Link To Document :
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