Title :
Algorithmic Diagnosis of Multichip Module Defects Using the IEEE 1149.1 Standard
Author_Institution :
Hewlett Packard, Colorado
Keywords :
Circuit faults; Circuit testing; Costs; Failure analysis; Fault diagnosis; Integrated circuit interconnections; Manufacturing; Multichip modules; Pins; System testing;
Conference_Titel :
Multichip Modules, 1994. Proceedings of the 1994 International Conference on
Print_ISBN :
0-930815-39-4
DOI :
10.1109/ICMCM.1994.753551