Title :
AT&T spl mu/Surface Mount Assembly: A New Technology for the Large Volume Fabrication of Cost Effective Flip-Chip MCMs
Author :
Dudderar, T.D. ; Degani, Y. ; Spadafora, J.G. ; Tai, K.L. ; Frye, R.C.
Author_Institution :
AT&T Bell Laboratories, Murray Hill, NJ
Keywords :
Assembly; Ceramics; Costs; Fabrication; Integrated circuit interconnections; Packaging; Silicon; Substrates; Surface-mount technology; Tiles;
Conference_Titel :
Multichip Modules, 1994. Proceedings of the 1994 International Conference on
Print_ISBN :
0-930815-39-4
DOI :
10.1109/ICMCM.1994.753561
