Title :
Evaluation of Ionic Salt Photodefinable Polyimides As Mcm-D Dielectrics with Copper Metallization
Author :
Lazaridis, C.N. ; Flattery, D.K. ; Lautenberger, W.J. ; Yamamoto, Y.S. ; Imai, K.
Author_Institution :
DuPont Electronic Materials, DuPont K. K. Technical Center, Japan
Keywords :
Adhesives; Copper; Costs; Dielectric materials; Fabrication; Inorganic materials; Metallization; Polyimides; Polymer films; Spine;
Conference_Titel :
Multichip Modules, 1994. Proceedings of the 1994 International Conference on
Print_ISBN :
0-930815-39-4
DOI :
10.1109/ICMCM.1994.753576
