DocumentCode :
2663420
Title :
Mcm-L Technologies: Myths and Experiences in Multiple Product Scenarios
Author :
Carey, David ; Hashemi, Hassan ; Hunter, Paul
Author_Institution :
Microelectronics and Computer Technology Corporation (MCC), Texas
fYear :
1994
fDate :
13-15 Apr 1994
Firstpage :
416
Lastpage :
423
Keywords :
Application software; Bonding; Circuit testing; Costs; Integrated circuit interconnections; Multichip modules; Packaging; Printed circuits; Space technology; Workstations;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Multichip Modules, 1994. Proceedings of the 1994 International Conference on
Print_ISBN :
0-930815-39-4
Type :
conf
DOI :
10.1109/ICMCM.1994.753584
Filename :
753584
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=2663420
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