A CMOS-compatible 24MHz poly-SiGe MEMS oscillator with low-power heating for frequency stabilization over temperature

Author

Jansen, R. ; Libois, M. ; Rottenberg, X. ; Lofrano, M. ; De Coster, J. ; Van Hoof, R. ; Severi, S. ; Van der Plas, G. ; De Raedt, W. ; Tilmans, H.A.C. ; Donnay, S. ; Borremans, J.

Author_Institution

Imec, Leuven, Belgium

fYear

2011

fDate

2-5 May 2011

Firstpage

1

Lastpage

5

Abstract

MEMS based timing devices have been proposed as an alternative to Quartz systems for certain applications. Through using an oven-controlled system it is possible to stabilize the frequency response of such a MEMS system over a large ambient temperature range. This work presents a BAW MEMS resonator in poly-SiGe which achieves significantly lower power consumption for frequency stabilization over temperature through Joule heating than for a similar system in SOI, while showing promising phase noise performance in an oscillator setup. Since the poly-SiGe resonator can be processed on top of standard CMOS, this enables the possibility of full integration of an Oven-Controlled MEMS Oscillator.

Keywords

CMOS integrated circuits; Ge-Si alloys; bulk acoustic wave devices; crystal oscillators; electric heating; frequency stability; micromechanical resonators; phase noise; timing; BAW resonator; CMOS; Joule heating; MEMS oscillator; SOI; SiGe; frequency 24 GHz; frequency stabilization; oven controlled system; poly-SiGe MEMS resonator; quartz systems; timing devices; Heating; Micromechanical devices; Phase noise; Resonant frequency; Silicon germanium; Temperature sensors;

fLanguage

English

Publisher

ieee

Conference_Titel

Frequency Control and the European Frequency and Time Forum (FCS), 2011 Joint Conference of the IEEE International

Conference_Location

San Fransisco, CA

ISSN

1075-6787

Print_ISBN

978-1-61284-111-3

Type

conf

DOI

10.1109/FCS.2011.5977769

Filename

5977769