Title :
No clean mass reflow of large over molded plastic pad array carriers (OMPAC)
Author :
Lau, J. ; Miremadi, J. ; Gleason, J. ; Haven, R. ; Ottoboni, S. ; Mimura, S.
Author_Institution :
Hewlett-Packard Co., Palo Alto, CA, USA
Abstract :
A no clean mass reflow process for 396-pin, 324-pin, and 225-pin over molded plastic pad array carriers (OMPAC) is presented. Emphasis is placed on the OMPAC assembly parameters, such as the design, material, and process of the packages and printed circuit board (PCB), solder paste, stencil design, printing technology, pick and place, mass reflow, and inspection. Cross sections and the "popcorn" effect of the OMPAC assembly are discussed
Keywords :
fine-pitch technology; integrated circuit packaging; plastic packaging; printed circuit manufacture; reflow soldering; OMPAC assembly parameters; PCB; SMT; ball grid array; fine pitch; inspection; large over molded plastic pad array carriers; no clean mass reflow process; pick and place; popcorn effect; printing technology; solder paste; stencil design; Assembly; Atherosclerosis; Ceramics; Electronics packaging; Lead; Pins; Plastics; Sliding mode control; Soldering; Surface-mount technology;
Conference_Titel :
Electronic Manufacturing Technology Symposium, 1993, Fifteenth IEEE/CHMT International
Conference_Location :
Santa Clara, CA
Print_ISBN :
0-7803-1424-7
DOI :
10.1109/IEMT.1993.398221
